The Summit 750 system was developed for users who demand the high performance characteristics of the Summit 1800 at a lower price.  This has been achieved by converting some of the automated functions to manual operations without sacrificing the essential capabilities of the system.  The system’s capabilities include QFP and BGA rework.

The Summit 750’s thermal, optical, and software features provide high reliability and ease of use together with the capability to handle the same large assemblies (18” x 22”) and wide range of components as the Summit 1100.