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The Summit
750 system was developed for users who demand the high
performance characteristics of the Summit 1800 at a lower price.
This has been achieved by converting some of the automated
functions to manual operations without sacrificing the essential
capabilities of the system. The system’s capabilities include QFP and BGA rework.
The Summit
750’s thermal, optical, and software features provide high
reliability and ease of use together with the capability to
handle the same large assemblies (18” x 22”) and wide range of
components as the Summit 1100.
For features
and specifications,
download a data sheet.
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