Scavenging, Site Dressing, Residual Solder Removal.  What’s in a name?  “That which we call an onion, by any other name would smell as strong” (apologies to the immortal bard).  And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB.   This paper will describe the various methods that are available and discuss their pros and cons.