VJ ELECTRONIX HAS BUILT A STRONG REPUTATION IN REWORK AND INSPECTION TECHNOLOGIES. HOW WOULD YOU DESCRIBE THE COMPANY’S DIRECTION AS THE INDUSTRY EVOLVES?

The trajectory of electronics manufacturing is unmistakable: assemblies are becoming larger, denser, and more complex, particularly in sectors like AI, aerospace, and power electronics. At VJ Electronix, we are focused on enabling manufacturers to keep pace with that complexity without compromising yield or reliability.

We are investing heavily in next-generation rework platforms, enhanced process control, and integrated solutions that combine precision heating, advanced vision, and data-driven optimization.

Our goal is to move beyond simply providing equipment. Instead, we want to deliver process confidence. Our focus on collaboration is just as important. Our innovations are developed in collaboration with the top OEMs and EMS providers, ensuring that what we build directly addresses real production challenges. That customer-driven approach will continue to guide where we’re headed.

THE SUMMIT LT150 HAS GENERATED SIGNIFICANT INDUSTRY ATTENTION. WHAT MARKET NEED LED TO ITS DEVELOPMENT?

The LT150 is a direct response to what we’ve been hearing from the market. As component sizes increase, especially with AI processors, power modules, and large BGAs, traditional rework systems begin to hit their limits.

Manufacturers told us they needed a solution capable of handling larger components and boards without sacrificing precision or thermal control. That’s what drove the development of the LT150. It was designed specifically to address the profile requirements and handling needs of large-format, high-density assemblies that are becoming increasingly common across advanced applications.

We didn’t just scale up an existing platform; we rethought how to deliver uniform heating, accurate alignment, and repeatable results at these larger dimensions.

FROM A TECHNICAL STANDPOINT, WHAT MAKES THE SUMMIT LT150 STAND OUT COMPARED TO PREVIOUS SYSTEMS?

There are several key innovations that define the LT150. First is the expanded 150 × 150 mm vision system that allows operators to view the entire component while still zooming into critical alignment points. That combination of macro and micro visibility is essential to help deliver confidence regarding placement on large devices.

Second is the thermal architecture. The system incorporates a 4.4 kW top heater paired with up to 11.2 kW of bottom-side heating. This balanced heating approach ensures consistent solder reflow across the entire component footprint from center to edge while minimizing thermal stress.

We’ve also integrated dual PID control, programmable airflow, and a dedicated spot heater. These features give engineers the ability to fine-tune thermal profiles for a range of materials and package types, which is critical when dealing with high-value assemblies.

Ultimately, it’s about delivering repeatability and process control at a scale that wasn’t previously achievable.

LARGE-FORMAT ASSEMBLIES OFTEN INTRODUCE MECHANICAL AND ACCESSIBILITY CHALLENGES. HOW DOES THE LT150 ADDRESS THOSE?

As assemblies grow, you’re not just dealing with larger components—you’re also dealing with taller connectors, heat sinks, and power modules. The LT150 accommodates board sizes up to 24 × 36 inches, with options for even larger formats. It also provides up to 100 mm of clearance on both the top and bottom sides, allowing safe access around tall components.

This level of accessibility is critical because it enables rework without compromising surrounding components. It reduces risk, improves ergonomics for the operator, and ultimately contributes to higher success rates.

SPEED AND THROUGHPUT REMAIN KEY CONSIDERATIONS FOR EMS PROVIDERS. HOW DOES THE LT150 BALANCE PRECISION WITH PRODUCTIVITY?

Traditionally, there’s been a tradeoff between precision and throughput, especially in rework. With the LT150, we’ve worked to eliminate that compromise. The combination of balanced heating, advanced control systems, and optimized airflow allows for faster thermal ramp-up and more consistent profiles. That translates into shorter cycle times without sacrificing quality.

At the same time, the system’s automation and intuitive software reduce operator intervention. This not only improves efficiency but also helps standardize processes across different operators and facilities.

THE LT150 RECENTLY RECEIVED AN INDUSTRY AWARD. WHAT DOES THAT MEAN FOR VJ ELECTRONIX AND YOUR CUSTOMERS?

Being recognized with a 2026 NPI Award is a strong validation of the work our team has done. More importantly, it reinforces that we’re solving real challenges for our customers.

For manufacturers, it provides confidence that the LT150 is not only innovative but also practical, reliable, and ready for production environments. That’s always our priority.

HOW DOES THE SUMMIT LT150 FIT INTO VJ ELECTRONIX’S BROADER PRODUCT STRATEGY?

The LT150 is part of a larger evolution of our Summit platform. We’ve built a portfolio that spans from smaller, highly precise systems to large-format solutions like the LT150. What ties them all together is a consistent focus on accuracy, thermal control, and ease of use.

We’re also continuing to integrate our rework systems with our X-ray inspection and component counting technologies to create a more connected manufacturing ecosystem. Looking to the future, you’ll see even more emphasis on data integration, process traceability, and automation.

HOW HAS THE GROWTH IN AI TECHNOLOGY AFFECTED VJ ELECTRONIX’S BUSINESS?

One of our strengths has been dealing with larger and more challenging rework applications. Demand for our large-board LXi and LT platforms has skyrocketed, especially over the last nine months. As a result, our lead times have increased.

We’re working hard to scale production to keep pace. It’s a good problem to have. I’m happy to say we have a great team and great suppliers, and we’re making steady progress to meet the growing demand.

FINALLY, WHAT DO YOU SEE AS THE BIGGEST CHALLENGE—AND OPPORTUNITY—FOR ELECTRONICS MANUFACTURERS IN THE COMING YEARS?

The biggest challenge is managing complexity. Assemblies are becoming more advanced, more expensive, and less tolerant of process variation. That raises the stakes for rework, inspection, and overall process control.

But with that challenge comes opportunity. Manufacturers who invest in the right technologies can significantly reduce scrap, improve yields, and maintain greater control over their production processes.

At VJ Electronix, our role is to provide the tools that make that possible. The Summit LT150 is a great example of how we’re helping customers take on challenges that were previously considered too difficult or risky and turn them into opportunities for growth.

Thank you for your time, Don.

www.vjelectronix.com

May 2026 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, has appointed The Murray Percival Company as its manufacturers’ representative for Illinois and Southern Wisconsin.

A third-generation, family-owned business with more than 60 years of experience, The Murray Percival Company is well known throughout the PCB and electronics assembly industry for its technical knowledge and strong customer relationships. The company supports manufacturers with a broad range of assembly equipment, materials, and production solutions, along with a focus on helping customers improve processes and maximize return on investment.

Through this partnership, Murray Percival will represent VJ Electronix’s full line of solutions, including automated rework systems, X-ray inspection platforms, and component counting systems. The goal is simple—provide local support and help manufacturers solve real production challenges with practical, proven technology.

“Bruce Clark and the Murray Percival team bring a deep understanding of the industry and a long track record of supporting customers the right way,” said Don Naugler, General Manager at VJ Electronix. “Their approach aligns well with how we work, and we’re looking forward to building on that in the Midwest.”

Bringing Murray Percival on board gives VJ Electronix a stronger local presence in a region with a solid base of electronics manufacturing, making it easier for customers to access support and expertise when they need it.

VJ Electronix continues to grow its North American rep network to stay closer to customers and respond more quickly.

For more information about VJ Electronix, visit www.vjelectronix.com.
For more information about The Murray Percival Company, visit www.murraypercival.com.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

Company Contact:

David Hamel, Director of Global Sales and Marketing 19 Alpha Road, Chelmsford, MA.USA 01824

+1 978 486 4777

www.vjelectronix.com

May 2026 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, has appointed MaRC Technologies, Inc. as its manufacturers’ representative in the Pacific Northwest.

Led by Mike Gunderson, MaRC Technologies supports electronics manufacturers and high-tech companies with equipment, materials, and technical solutions. Headquartered in Oregon, the company has built long-standing relationships across the region and brings a strong understanding of the local customer base.

This appointment builds on VJ Electronix’s existing relationship with the MaRCTex team, following more than a year of successful collaboration supporting customers in Texas. Expanding that partnership into the Pacific Northwest provides continuity for customers while strengthening VJ Electronix’s presence in another key U.S. manufacturing region.

“Mike and his team have already proven to be a strong partner for us,” said Don Naugler, General Manager at VJ Electronix. “They understand the applications, they know the customers, and they’ve done a great job representing our solutions. Expanding into the Pacific Northwest was a natural next step.”

MaRC Technologies will represent VJ Electronix’s full portfolio of solutions, including automated rework systems, X-ray inspection platforms, and component counting systems. The partnership is focused on providing local support and helping customers address real production challenges, from rework of complex assemblies to inventory control and inspection.

“We’ve had the opportunity to work closely with VJ Electronix over the past year, and it’s been a great fit,” said Mike Gunderson, MaRC Technologies. “Their equipment solves real problems on the production floor, and we’re looking forward to bringing that same level of support to customers in the Pacific Northwest.”

VJ Electronix continues to expand its North American representation network to better support customers with local expertise and faster response times.

For more information about VJ Electronix, visit www.vjelectronix.com.

For more information about MaRC Technologies, visit www.marctechnologies.com.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

Company Contact:

David Hamel, Director of Global Sales and Marketing 19 Alpha Road, Chelmsford, MA.USA 01824

+1 978 486 4777

www.vjelectronix.com

February 2026 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, has been honored with a 2026 NPI Award in the Repair & Rework Tools category for its Summit LT150 rework system, a next-generation platform designed for large, high-density electronic components.

The LT150 builds on the company’s Summit platform, giving operators a 150 × 150 mm vision area to see the entire component while zooming in on corners for exact alignment. It supports standard board sizes up to 24 × 36 inches, with an optional upgrade for even larger formats, and provides up to 100 mm of top- and bottom-side clearance to safely reach tall connectors, heat sinks, and power modules.

A 4.4 kW top heater paired with up to 11.2 kW of bottom-side heating delivers even thermal performance across large components, keeping solder reflow consistent from center to edge while reducing thermal stress. Balanced heating, dual PID control, programmable airflow, and a 1.5 kW spot heater let operators fine-tune profiles for different materials and package types. The result: faster cycle times, improved throughput, and reliable rework of high-value components.

“The Summit LT150 gives manufacturers the tools to take on assemblies that were previously difficult or risky to rework,” said Don Naugler, General Manager, VJ Electronix. “It’s designed to make large-component rework safer, faster, and more accurate, helping reduce scrap and avoid unnecessary board replacements.”

The NPI Award highlights VJ Electronix’s focus on practical solutions that meet the demands of modern electronics manufacturing.

For more information about VJ Electronix, visit www.vjelectronix.com.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

Company Contact:

David Hamel, Director of Global Sales and Marketing 19 Alpha Road, Chelmsford, MA.USA 01824

+1 978 486 4777

www.vjelectronix.com

VJ Electronix Introduces Summit LT150 Rework System for Large, High-Density Assemblies

New platform developed with leading AI OEMs and EMS providers enables reliable rework of components up to 150 mm

March 2026 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced the launch of the Summit LT150, a new addition to its Summit rework platform designed to handle the growing size and complexity of modern electronics assemblies.

The Summit LT150 was developed following extensive roadmap discussions with leading OEMs in the artificial intelligence sector and top electronics manufacturing services (EMS) providers. As AI, power electronics, and high-density systems continue to push the limits of board size and component scale, manufacturers require rework solutions capable of handling larger packages without sacrificing precision or thermal control.

Building on the success of the Summit LT120, the LT150 supports reliable rework of components up to 150 mm. A large 150 × 150 mm vision area allows operators to view the entire component while still zooming into corners for precise alignment and placement.

The system accommodates standard board sizes up to 24 × 36 inches, with an optional upgrade available for even larger formats. Increased clearance—up to 100 mm on both the top and bottom sides—provides safe access around tall connectors, heat sinks, and power modules commonly found in high-power assemblies.

To maintain consistent solder reflow across large component footprints, the LT150 combines a proprietary 4.4 kW top heater with up to 11.2 kW of bottom-side heating. This balanced approach helps maintain uniform temperatures from the center of the component to the edges while minimizing thermal stress on the assembly.

Dual PID control, programmable airflow, and a more powerful 1.5 kW spot heater work in conjunction allowing operators to fine-tune thermal profiles for large challenging AI components. These capabilities help shorten cycle times while maintaining consistent rework quality.

“Manufacturers are dealing with larger components and increasingly complex assemblies, particularly in AI and high-power applications,” said Don Naugler, General Manager of VJ Electronix. “The Summit LT150 was developed directly with input from OEM and EMS partners to ensure it addresses the real challenges they’re seeing on the production floor.”

Interest in the LT150 has been strong following the success of the Summit LT120 platform, as manufacturers look for ways to perform reliable, in-house rework on high-value boards without risking damage or unnecessary replacement.

For more information about VJ Electronix and the Summit LT150 rework system,visit www.vjelectronix.com.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

Company Contact:

David Hamel, Director of Global Sales and Marketing 19 Alpha Road, Chelmsford, MA.USA 01824

+1 978 486 4777

www.vjelectronix.com

The new Auto Align feature allows for the alignment of components, including components larger than 100mm, with no operator intervention. The software recognizes the corners of the component and site using fiducials, and then pick locations (centerpoint) are determined automatically.

The Summit 2200i is a high precision, automatic system for small to large SMD assemblies that is capable of handling printed circuit boards up to 22″x 30” and components as small as 01005. The system utilizes efficient convection heating and closed-loop temp control to mimic thoughtfully designed oven profiles.

The system’s easy-to-use 1-2-3-GO graphical user interface and flexible SierraMate rework software minimize operator intervention while maintaining tight process control of all critical parameters and provides product traceability, profile analysis and sharing of profiles between VJE systems.

The independent non-contact site scavenger head safely removes residual solder, eliminates the potential for damage to pads and solder mask, and allows a continuous process without tool change. Operators can complete rework in a single thermal cycle.

For more information about software upgrades, new system purchase or to schedule a demo, visit http://www.vjelectronix.com or  email electronixsales@vjt.com.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

FOR IMMEDIATE RELEASE

July 2022 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that Rocket EMS, Inc. has installed its second XQuik II Plus component counter. When the company acquired its new 50,000 sq ft. facility in Carson City, Nevada, they made the decision to outfit it with the award-winning XQuick II Plus. Rocket EMS now operates an X Quik II at its new Carson City facility as well as its headquarters in the heart of Silicon Valley.

“Working at a fast-paced environment like Rocket EMS is never an easy task to do singlehandedly,” stated Geenno Fontanilla, Director of Engineering at Rocket EMS.

“That is why we rely on partnerships with equipment suppliers like VJ Electronix to provide us with technologically advanced equipment. The XQuick II Plus has been a work horse in our receiving and warehouse departments at both our Nevada and California sites. As we move forward to integrate this into our Voyager 2.0 MES system, our customers would soon have visibility at a component level to ensure accuracy and traceability of their materials on demand.”

The VJ Electronix XQuik II Plus is the solution to today’s demanding component counting requirements. With a cycle time of less than 20 seconds (for both single reel and quad counts), the XQuik II Plus is designed for operational simplicity and automation flexibility. It is easily configured to communicate with any existing MES inventory control system and a sample interface, along with detailed instructions, is provided for the customer’s IT team to quickly customize for their specific needs.

Rocket EMS, founded in Jan 2011, is a Santa Clara, Calif.-based Electronic Manufacturing Services (EMS) company serving fast-growth, high-technology companies. The company is uniquely positioned to meet the very high demands of New Product Introduction (NPI) manufacturing and test. Rocket is a one-stop partner, specializing in ultra-quick-turn (24 – 48 hour) manufacturing of Printed Circuit Boards (PCBs), design and complementary services.

For more information about Rocket EMS, visit www.rocketems.com.

For more information or to schedule a demo, visit www.vjelectronix.com.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

Company Contact:

David Hamel, Director of Global Sales and Marketing
19 Alpha Road, Chelmsford, MA.USA 01824
1 978 486 4777

June 2021 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced the appointment of Southwest Systems Technology, Inc. to represent its rework, x-ray inspection, and x-ray component counting systems in the states of Texas, Oklahoma, Arkansas and Louisiana.

“VJ Electronix products are technically solid with great value and performance,” stated Scott Fillebrown, Managing Director at Southwest Systems. “They are exactly what I looked for at my former contract manufacturing company and we are excited to be working with them.”

For more than 33 years, Southwest Systems Technology has been providing sales and service for equipment and materials in both the electronic assembly and semiconductor manufacturing industries. Southwest Systems’ sales engineers are trained in the latest industry processes and technologies.

For more information about Southwest Systems Technology, contact Scott Fillebrown at Scott@SWSystems.com or visit www.swsystems.com.

For more information about VJ Electronix, visit www.vjelectronix.com.

About Southwest Systems Technology, Inc.

Southwest Systems Technology, Inc., was founded in 1989. The company has offices in Dallas, Austin, El Paso, McAllen, and Guadalajara, Mexico. Southwest Systems’ philosophy is to technically present the myriad of products it represents in a thorough and professional manner; proficiently and with discerning sophistication. The company sells products in both the electronic and semiconductor manufacturing industries. It sells capital equipment and materials, and its sales engineers are trained in the latest industry processes and technologies. For more information, visit www.swsystems.com.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

Company Contact:

David Hamel, Director of Global Sales and Marketing
19 Alpha Road, Chelmsford, MA.USA 01824

+1 978 486 4777

www.vjelectronix.com

VJ Electronix accepts 25^th industry award in less than 20 years!

February 2022 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that it received a 2022 CIRCUITS ASSEMBLY NPI Award in the category of Test and Inspection – AXI for its new APOGEE 90 X-ray inspection system. The award was announced during a special online ceremony on Monday, Feb. 24, 2022. This marks the company’s 25^th industry award as VJ Electronix approaches its 20^th year in business.

The APOGEE 90 microfocus X-ray inspection system is an advanced at-line NDT solution for manual (MXI) or semi-automated Inspection (AXI) of printed circuit boards, components and assemblies. The system is equipped with a 90kV, sealed, microfocus X-ray source that can achieve a spot size as small as 4µm, a 5” HD Digital Flat Panel Detector with 85µm resolution, and 6-axis motorized motion control with oblique angle inspection of up to 45°.

With minimal training, operators can intuitively utilize valuable tools for basic inspection and enhanced analysis of BGAs, QFNs and more. The APOGEE 90 provides reliable inspection for operators to capture the highest clarity 2D & 2.5D X-ray images for defect detection and failure analysis in production environments.

The APOGEE 90 offers optimal performance and operability at a fraction of the cost of comparable X-ray inspection systems. Creatively designed with the superior resolution and automation typically found in higher cost systems, the APOGEE 90 is one of the most powerful and economical X-ray inspection systems to hit the market in 2022.

“The APOGEE 90 is a cost-effective solution that provides the best of both worlds,” Donald Naugler, CTO. “It is very easy to set up automated inspection routines for BGA, PTH and more. For quick manual inspection, the on screen navigation allows the user to click on a picture of the sampl and the manipulator automatically centers the selected object in the live X-ray image.”

Introduced in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information or to schedule a demo, contact electronixsales@vjt.com.

Abstract—High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that may occur during packaging, shipping, and customer handling. This defect condition is especially problematic for automated assembly which strives to be touch-free and efficient with orderly device presentation.

COOP is a major contributor to “Cost Of Poor Quality” (COPQ) within the business. A funded study into COOP conditions was conducted and multiple root causes were identified.

It was discovered that traditional “waffle packs” have mechanical issues related to looser flatness tolerances with respect to the tray and lid. The addition of a standard clip further contributes to the issue, both of which are key root causes of the costly “Component Out Of Pocket” (COOP) condition.

A novel Lid-Clip System (LCS2) was engineered to compensate for those mechanical issues, bringing robust captivation and preservation of devices in tray pockets. Static dissipative material for lid and clip was selected to provide unparalleled ESD Class 000 protection for high value devices with the lowest voltage susceptibility thresholds.

INTRODUCTION

This paper describes the multiple root causes of the “Component Out Of Pocket” (COOP) (Fig. 1) defect condition in waffle packs that has persisted in the microelectronics industry for decades, complicating the task of achieving zero defects and driving manufacturing costs. Military aerospace and commercial manufacturers alike, worldwide are incurring unnecessary costs in the form of component damage, component scrap, and the non-value added labor associated with “fixing” induced waffle pack defects. Innovation in transportation, handling, preservation, and storage for semiconductor ICs has been lacking.

This is important because semiconductor devices in particular are costly and the additional assembly labor and equipment down time is a cost driver in manufacturing operations that use components with thickness of 0.010-inch and less. These components are particularly susceptible to this defect condition.

II.CHARACTERIZATION / ROOT CAUSES

Multiple causes of COOP defects have been identified (Fig. 2). Many semiconductor industry professionals have failed to recognize the implications of published flatness specifications [1] associated with injection molded trays and lids (i.e., 0.012-inch carbon loaded polypropylene, 0.004-inch carbon loaded polycarbonate) (Fig. 3). For a thin GaAs die, that leaves plenty of egress for escape. Consider the tolerance stack up when selecting from standard lids and trays as it could be as high as 0.024-inch and 0.008-inch for poly-propylene and polycarbonate, respectively. Standard clips also impart deflection of lid and tray material due to the design as shown in (Fig. 4).

For decades, end users and suppliers of components in waffle packs have been pointing fingers, casting blame on one another for migrated components. Keyence VR-3200 3D Scanner [2] was key to visualizing and measuring the flatness tolerances that led to the mechanical issues that cause COOP (Fig. 5). With the advent of an x-ray counter system by VJ Electronix model XQuik II [3] (Fig. 5) developed for BAE Systems

in 2017, specifically designed to count components in sealed waffle packs at the receiving inspection level, we have definitively proven that COOP occurs both at supplier sites and during transit, well before end users have the opportunity to open waffle packs.

Principally, flatness tolerances of the various materials used in the manufacture of waffle pack trays and lids were visualized and measured using equipment shown in (Fig 5). Semiconductor industry component suppliers are typically unaware they are shipping components out of pocket because few employ x-ray systems to validate the effectiveness of their final packaging operation. While there is plenty of blame to be shared for COOP, including by end users, we now have a clearer understanding of the mechanical issues which top the list of multiple root causes.

Figure 6 shows dark orange locations A and C on inside of cover that act as standoffs when contacting top of tray thus allowing components to migrate under the blue locations that measure up to a 0.0094-inch gap.

Another prevalent cause of COOP is the misalignment of loose inserts that leads to pinching of inserts used for the waffle pack assembly process (Fig. 7). One misconceptions is that loose inserts prevent COOP however, our research has shown it can actually contribute to it, as when inserts are misaligned or pinched which is frequently the case. Pinched inserts can be evident along edge in between tray and lid.

The risk of device damage is inherent to components when working with loaded waffle packs with that risk amplified for components ≤0.010-inch thick. The risk of COOP is present when clips are attached and removed, because the lids are essentially unsecured and waffle packs are being tilted to some extent; the lid can pop up on one side when unequal pressure is applied by operator to opposite side of waffle pack. That condition combined with the slightest vibration can cause COOP. It is at this stage of the packing and unpacking process where components are also at significant risk for migration (Fig. 8).

In response to the multiple deficiencies identified in the most commonly used bare die packaging (i.e., waffle pack/chip tray), a novel Lid-Clip System (LCS2) was engineered to pair with these warped pocketed trays to ensure optimal component preservation through the effective gasketing in each and every pocket in order to establish a new industry best practice and defect free transport/handling solution. LCS2 represents an important new option for the mitigation of “COOP”. Our solution is an enhanced lid comprised of low outgassing, static dissipative, low density polyurethane foam and industry-approved interleaf material assembled into a static dissipative injection molded lid using silicone free pressure sensitive adhesive (Fig 9). This is combined with a novel clip design (Fig 9 and Fig 10) which uniformly compresses the lid around its full perimeter, ensuring intimate contact of the entire interleaf against the warped waffle tray surface (Fig 11).

Static dissipative material for the injection molded lid and clip was selected and tested per ANSI/ESD S11.11 to provide ESD Class 000 protection for high value devices with the lowest voltage susceptibility thresholds.

Efficacy of the Lid-Clip System has been demon-strated through rigorous drop testing of 0.002-inch GaN devices from 34 inches using x-ray to verify containment or the absence of COOP condition (Fig. 12). Ten unique novel lids and novel clips were tested and dropped a total of 10 times each for 100 total drops with no detected COOP (Fig. 9). When the standard industry clip was substituted for the new innovative clip, COOP occurred (Fig. 12) demonstrating need for the novel clip.

Overall, this novel Lid-Clip System solves for the costly “Component Out Of Pocket” condition for all sized components but especially for ultra thin components ≤0.010-inch. This system also reduce non-value added Supplier Corrective Action Requests/Return Material Authorizations. The Lid-Clip System has tremendous potential to curb millions of dollars in waste and improve component process efficiencies worldwide.

REFERENCES

[1] Entegris website Tray Wizard (entegris.com)

[2] Keyence website Models: Wide-Area 3D Measurement System | KEYENCE America Ryan Mathes

[3] X-Ray – VJ Electronix, Robert Kerwin

[4] Forgione Engineering, Matteo Forgione