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Summit LT150

Summit LT150

High performance extra large board rework system for components up to 150 x 150mm

  • Rework of next generation components up to 150 mm
  • World leading reliability
  • Reduced cycle times
  • Proprietary next generation heating
  • Improved profile control
  • Optimized for larger boards
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The go-to rework system for AI, and large board applications. The Summit LT150 is ideal for reworking your most difficult boards up to 25"x47" and components as small as 0201

Built with easy-to-use 1-2-3-GO Software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE Systems.

Features

Easy-To-Use Auto Profiling Software
  • User-friendly, simple thermal profile development
  • Default reflow profiles for standard rework processes
  • Advanced profile analysis software confirms successful profile development
  • Automatic reflow, remove, and replace scavenging sequences
Simple Component-to-Site Alignment
  • Two-color LED optical alignment
  • Motorized and programmable Z and Theta axis minimizes operator intervention
Repeatable Thermal Performance
  • Efficient Convection Heaters provide high thermal uniformity
  • Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements
Automatic Non-Contact Site Scavenging
  • Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
  • Nitrogen capability for consistent results without post scavenge cleaning
MES Interface
  • Track all operations performed on rework system from automatic event log
  • Reflow processes easily transferred between systems
Available Tooling for Any Surface Mount Component
  • Standard nozzles for conventional components
  • Special nozzles for unique components

Specifications

Technical Parameters
  • Maximum Board Size: 600 x 900mm (650 x 1200mm optional)
  • Minimum Component Size: 0201
  • Field of View: 150mm Square
  • Thermocouple Jacks: 8 (16 optional)
  • Theta Motion: 360°
  • Top Heater: 4400W
  • Area Heater: 10,000W
  • Site Heater: 1500W
Summit LT150

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