Explore the VJ Electronix blog for insights on X-ray inspection, BGA rework, component counting, electronics manufacturing trends, and industry expertise.
March 2026 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced the launch of the Summit LT150, a new addition to its Summit rework platform designed to handle the growing size and complexity of modern electronics assemblies.
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to introduce the new Component Auto Align option for its Summit 2200i rework system. The system can now be upgraded via software or purchased new with the option for Component Auto Align.
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that Rocket EMS, Inc. has installed its second XQuik II Plus component counter. When the company acquired its new 50,000 sq ft. facility in Carson City,
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced the appointment of Southwest Systems Technology, Inc. to represent its rework, x-ray inspection, and x-ray component counting systems in the states of Texas, Oklahoma, Arkansas and Louisiana.
VJ Electronix accepts 25th industry award in less than 20 years! February 2022 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that it received a 2022 CIRCUITS ASSEMBLY NPI Award in the category of Test and Inspection
Rich Rochford, Electronic Combat Solutions, BAE Systems Nashua, NH Richard.Rochford@baesystems.com Craig Blanchette, Electronic Combat Solutions BAE Systems Nashua, NH Craig.Blanchette@baesystems.com Abstract—High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that may occur during
