High Precision, Automatic Rework System for Small to Large SMDs and PCB Assemblies
Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and repeatable rework processes. Motorized X, Y, Z, and theta axis and Component Auto Align software allow for fully automated rework, including components greater than 100mm. Independent non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.
The Summit 2200i is our top-of-the-line automatic rework system equipped to handle boards up to 22" x 28" It has the ability to program and control X,Y, and Z-axis and Theta. Additionally, motorized top heater travel, component pick-up tube, zero-force component removal, component height sensing, optical alignment view height, shuttle position, part nest, and vision optics allow for the development of a fully automated rework process.
Our easy-to-use 1-2-3 GO graphical user interface makes operating this rework system simple. Perform removal, scavenge, replace, and reflow on multiple components in a single rework cycle without any operator intervention.
Unique software allows for alignment of components, including 100mm or larger, with no operator intervention required. The software automatically detects components and sites using fiducial recognition and the pick/place locations are determined automatically.
Optional 1.0kW bottom-area site heater reduces die/package temperatures by minimizing their thermal exposure and improving thermal uniformity. This provides greater process tolerance and throughput and is optimal for large component/PCB applications.
Run continuous process with an independent and automatic non-contact site scavenger head. Operators can program and complete rework in a single thermal cycle without tool change. Dynamic height sensing control eliminates the risk of damaging pads during solder removal. Nitrogen capability for consistent results without post scavenge cleaning.
Fast and easy profile creation. Simply enter the desired product temperatures. After thermal profile is created, the entire reflow process is built automatically and ready to run.
Track all operations performed on the Summit 2200i rework system directly from an automatic data and event log to your EMS. Reflow processes can easily be shared or transferred between systems with enhanced profile sharing and user collaboration.
Automatic Component Alignment via Fiducial Recognition
High performance extra large board rework system for components up to 120 x 120mm
High precision, semi-automated system for medium to large PCB assemblies
High precision, automatic alignment system for very large boards
