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VJ Electronix Summit LXi
Summit LXi

High precision, automatic alignment system for very large boards

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The go-to rework system for 5G, and large board applications. The Summit LXi is capable of handling boards up to 25"x47” and components as small as 01005.

Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE systems.

Features

Easy-To-Use Auto Profiling Software
  • User-friendly, simple thermal profile development
  • Default reflow profiles for standard rework processes
  • Advanced profile analysis software confirms successful profile development
  • Automatic reflow, remove, and replace profile created after development of Auto Profile
Simple Component-to-Site Alignment
  • Two-color LED optical alignment system allows for easy-to-see component to site alignment
  • Motorized and programmable Z and Theta axis minimizes operator intervention
  • Motorized and programmable X-Y table (option) for simplified component alignment
Repeatable Thermal Performance
  • Efficient Convection Heaters provide high thermal uniformity
  • Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements
Automatic Non-Contact Site Scavenging
  • Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
  • Programmable X,Y, and Z axis eliminates operator intervention
  • Nitrogen capability for consistent results without post scavenge cleaning
MES Interface
  • Track all operations performed on rework system from automatic event log
  • Reflow processes easily transferred between systems
Available Tooling for Any Surface Mount Component
  • Standard nozzles for conventional components
  • Special nozzles for unique components

Specifications

Technical Parameters
  • Placement Capability: 0.0010” (12µ) mean + 3σ
  • Maximum Board Size: 600 x 900mm (650 x 1200mm optional)
  • Minimum Component Size: 01005 80mm (3.2”) Square (90mm optional)
  • Thermocouple Jacks: 8 (16 optional)
  • Theta Motion: 360°
  • Top Heater: 2200W
  • Area Heater: 10,000W
  • Site Heater: 1000W
Summit-750i-Data-Sheet-1-300x215
Summit-750i-Data-Sheet-2

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