VJ Electronix Introduces Summit LT150 Rework System for Large, High-Density Assemblies
March 2026 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced the launch of the Summit LT150, a new addition to its Summit rework platform designed to handle the growing size and complexity of modern electronics assemblies.
Eliminate Costly Component Out Of Pocket Defect Condition during Semiconductor IC Transport/Handling
Rich Rochford, Electronic Combat Solutions, BAE Systems Nashua, NH Richard.Rochford@baesystems.com
Craig Blanchette, Electronic Combat Solutions BAE Systems Nashua, NH Craig.Blanchette@baesystems.com
Abstract—High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that may occur during