Eliminate Costly Component Out Of Pocket Defect Condition during Semiconductor IC Transport/Handling
Rich Rochford, Electronic Combat Solutions, BAE Systems Nashua, NH Richard.Rochford@baesystems.com Craig Blanchette, Electronic Combat Solutions BAE Systems Nashua, NH Craig.Blanchette@baesystems.com Abstract—High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that may occur during packaging, shipping, and customer handling. This defect […]
Rich Rochford, Electronic Combat Solutions, BAE Systems Nashua, NH Richard.Rochford@baesystems.com Craig Blanchette, Electronic Combat Solutions BAE Systems Nashua, NH Craig.Blanchette@baesystems.com Abstract—High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that may occur during packaging, shipping, and customer handling. This defect